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Strategic Analysis of Shengyi Technology's Response to the Centralized Capacity Expansion Trend of Downstream Printed Circuit Board (PCB) Manufacturers

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January 16, 2026

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Strategic Analysis of Shengyi Technology’s Response to the Centralized Capacity Expansion Trend of Downstream Printed Circuit Board (PCB) Manufacturers
I. Industry Background: Centralized Capacity Expansion of PCB Manufacturers and Supply-Demand Pattern of Copper Clad Laminates
1.1 Downstream PCB Manufacturers’ Capacity Expansion Trend

Currently, the global PCB industry is experiencing a significant capacity expansion cycle, driven primarily by the following factors:

Booming Demand for AI Servers
: According to market forecasts, NVIDIA’s GB300 AI server cabinet shipments are expected to reach 55,000 units in 2026, representing a year-on-year growth of 129%[1]. The increasing complexity of AI hardware has directly boosted demand for high-density interconnect (HDI) boards, high-speed copper clad laminates (CCLs), and high-frequency high-speed materials.

Capacity Migration to High-End Segments
: Overseas CCL manufacturers are gradually exiting mid-to-low-end market segments such as FR4, M2, and M4, while mainland Chinese manufacturers are accelerating their shift to higher-end products such as M6, M7, and M8[2]. This structural change has led to tight supply of mid-to-low-end products and surging demand for high-end products.

Leading Players like Kingboard Laminates Actively Expanding Capacity
: As of 2025, 20 new high-speed CCL production lines have been added, with annual capacity jumping to 60 million square meters, and the proportion of high-end products increasing to 35%[2].

1.2 Changes in CCL Supply-Demand Relationship
Indicator 2024 2025(E) 2026(E)
CCL Demand Growth Rate 8% 15% 18%
CCL Capacity Growth Rate 6% 12% 14%
Supply-Demand Gap Tight Continuously Widening High-End Shortage

The continuous rise in upstream copper prices (exceeding USD 11,000 per ton) and persistently high prices of glass cloth and resin have pushed the CCL industry into a price hike cycle. Kingboard Laminates has issued two price increase notices in 2025, indicating the sustainability of CCL price increases[2].


II. Shengyi Technology’s Response Strategies
2.1 Strategic Layout 1: Large-Scale Capacity Expansion

RMB 4.5 Billion High-Performance CCL Investment Project
(Latest Announcement in January 2026)[3]:

  • Project Positioning
    : High-performance CCL project, applied in cutting-edge fields such as AI, cloud computing, 6G communications, and intelligent automotive electronics
  • Investment Scale
    : Approximately RMB 4.5 billion
  • Construction Location
    : Dongguan Songshan Lake High-Tech Industrial Development Zone
  • Strategic Significance
    : Rapidly respond to the strong growth demand for high-performance CCLs in the global market, further enhance the company’s core competitiveness and product market share

Existing Capacity Layout
:

  • Dongguan Headquarters: Songshan Lake Plant has become the largest CCL production base in South China
  • Holding joint ventures established in Xianyang, Shaanxi, Suzhou Singapore Industrial Park, Lianyungang, and other locations
  • Globalized layout ensures delivery capability[1]
2.2 Strategic Layout 2: Technology Upgrading and High-End Product Breakthroughs

Shengyi Technology has profound technical reserves in the field of high-frequency high-speed CCLs:

Technical Field Competitive Advantages Application Scenarios
High-Speed CCLs Technology benchmarked against international leader Panasonic 112G optical modules, AI server PCBs
High-Frequency Materials Low dielectric constant, low dielectric loss 5G communications, radar, satellite communications
High Reliability Automotive-grade and server-grade certifications Intelligent automobiles, data centers

The company has successfully entered the supply chains of leading AI players such as NVIDIA and Huawei[1]. With profound technical reserves in high-frequency high-speed sheet materials, the revenue share from automotive and server segments continues to increase.

2.3 Strategic Layout 3: In-Depth Customer Binding

Core Customer Matrix
:

  • Communication Equipment
    : Huawei, ZTE, Nokia
  • Consumer Electronics
    : Samsung, Apple, Xiaomi
  • Automotive Electronics
    : Tier 1 suppliers such as Bosch
  • Servers
    : Huawei, NVIDIA supply chain, Inspur, Lenovo[4]

Through in-depth cooperation with leading customers, Shengyi Technology can obtain demand information in advance, optimize capacity allocation, and improve order visibility.

2.4 Strategic Layout 4: Cost Optimization and Vertical Integration
  • Raw Material Cost Control
    : Establish strategic cooperation with upstream copper foil and electronic cloth suppliers to reduce the risk of raw material price fluctuations
  • Production Efficiency Improvement
    : Dongguan Plant features high automation, and unit production costs have been continuously optimized
  • Scale Effect Release
    : In the first three quarters of 2025, the company achieved operating revenue of RMB 20.614 billion and net profit attributable to parent company of RMB 2.443 billion, representing a year-on-year growth of 78.04%[3]

III. Shengyi Technology’s 2025 Operating Performance
3.1 Impressive Financial Data
Indicator Value Year-on-Year Growth
First Three Quarters Operating Revenue RMB 20.614 billion -
First Three Quarters Net Profit Attributable to Parent Company RMB 2.443 billion 78.04%
Non-GAAP Net Profit - 81.25%
Q3 EPS USD 0.42 1.57% Exceeding Expectations
Q3 Operating Revenue USD 7.93 billion 1.80% Exceeding Expectations
3.2 Strong Stock Price Performance
Period Increase
6 Months +91.43%
1 Year +173.91%
3 Years +344.34%

As of the closing price of USD 68.34 on January 15, 2026, the current stock price is above the 20-day moving average (RMB 69.02) and 50-day moving average (RMB 62.79), with a range-bound technical pattern[0].


IV. Competitive Advantages and Risk Analysis
4.1 Core Competitive Advantages
Competitive Advantage Specific Performance
Market Position Has maintained the second position globally in rigid CCL sales revenue since 2013
Technical Barriers National-level enterprise technology center, the only CCL enterprise with a national-level R&D institution
Customer Resources Obtained certifications from international renowned enterprises such as Siemens, Samsung, Huawei, and Nokia
Capacity Scale Multi-base global layout, total capacity leading in the industry
Policy Support Aligns with national industrial policy orientation, supported by the “Action Plan for Stabilizing Growth of Electronic Information Manufacturing Industry (2025-2026)”
4.2 Potential Risk Factors
Risk Type Specific Content
Project Approval Risk The specific plan of the RMB 4.5 billion project still awaits final approval from the board of directors or shareholders’ meeting
Cash Flow Pressure The RMB 4.5 billion investment scale may cause periodic pressure on the company’s cash flow
Industry Competition Competitors such as Kingboard Laminates are also actively expanding capacity
Raw Material Prices Copper price fluctuations have a significant impact on the cost side
Demand Falling Short of Expectations There is uncertainty in the growth of AI server demand

V. Investment Recommendations and Outlook
5.1 Short-Term (2025-2026)
  • Release of Price Hike Dividends
    : The sustainability of CCL price hikes is expected to continue driving performance improvement in Q4 2025 and 2026
  • Gradual Capacity Release
    : The RMB 4.5 billion investment project will be put into production in phases, contributing incremental revenue
  • Improved Order Visibility
    : Strong AI server orders are expected to maintain full-capacity production and sales
5.2 Medium-to-Long Term (2027 and Beyond)
  • Domestic Substitution of High-End Materials
    : Broad room for import substitution in high-speed CCLs, low-dielectric materials, and other fields
  • Expansion of Application Scenarios
    : New applications such as 6G communications, intelligent automobiles, and low-orbit satellites will bring incremental demand
  • Increasing Industry Concentration
    : Leading enterprises are expected to continue expanding market share with technological and scale advantages
5.3 Valuation Level

Current PE (TTM) is 58.88x, PB (TTM) is 10.65x[0]. Considering the company’s high performance growth and sustained industry boom, the valuation premium is reasonable.


Conclusion

In response to the centralized capacity expansion trend of downstream PCB manufacturers, Shengyi Technology has adopted an integrated four-pronged strategy of

“Capacity Expansion + Technology Upgrading + Customer Binding + Cost Optimization”
. The RMB 4.5 billion high-performance CCL investment project is a key strategic layout for the company’s future, which will further enhance its core competitiveness and product market share.

Against the backdrop of booming AI server demand, continuous CCL price hikes, and increasing industry concentration, as a global leader in the rigid CCL industry, Shengyi Technology is expected to fully benefit from this industry boom cycle, achieving a double growth in performance and valuation.


References

[1] NVIDIA GB300 Shipment Boom Ignites AI Server Supply Chain

[2] Kingboard Laminates: The CCL Target with the Highest Current Odds

[3] Shengyi Technology Signs RMB 4.5 Billion Investment Intent Agreement

[4] Forward-Looking Layout, Leading Innovation: Shengyi Technology Continues to Lead the CCL Track

[0] Jinling AI Financial Database (Real-time Market, Financial Data, Technical Analysis)

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Insights are generated using AI models and historical data for informational purposes only. They do not constitute investment advice or recommendations. Past performance is not indicative of future results.